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Gospell Digital technology Co., LtdFree·1YRS
GT1300 PTFE High Frequency Copper-Clad-Laminate
NegotiableUpdate on September 29
- Model
- Nature of the Manufacturer
- Other
- Product Category
- RF Copper-clad plate(CCL)
- Place of Origin
- City, Province
Overview
Main Features• Excellent High Frequency Performance• Antenna Positioning Systems• Adapt To Complex Multilayer High Frequency• Wireless Communication System• Excellent Electrical Performance and Machining Performance
Product Details
Product Overview
GT1300 laminate is a product of special enforcement by glass fibre composed with PTFE; it is a kind of circuit board material which can carry out a lot of information processing under UHF (GHz). Good performance stability with its low Dk and Df.Good for mechanical operation, better electronic performance stability. Microwave includes planar and non-planar structure, such as antenna, complex multilayer circuit, interlayer connection and microwave circuit for the design of aerospace.
Technical Specifications
Specifications Laminates | ||
standard thickness | standard size | standard copper foil |
0.005〞(0.127mm) | 48 X 36 (1220mm*914mm) | ½ oz. (18μm) HTE (H/H) |
0.010〞(0.254mm) | 24 X 18 (610mm*457mm) | 1 oz. (18μm) HTE (H/H) |
0.025〞(0.635mm) | 18 X 12 (457mm*305mm) | ½ oz. (18μm) RTF (H/H) |
0.050〞(1.270mm) | 1 oz. (35μm) RTF (1/1) | |
Test Performance | |||||
Performance | Typical Value | Direction | Unit | Treatment Condition | Test Method |
GT1300 | |||||
DK | 3.0±0.05 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
DF | 0.002 | ||||
0.003 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Temperature coefficient of Dk | -25 | Z | ppm/℃ | -50 -- 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.9*107 | XY | MΩ*cm | COND A | IPC-TM-650 2.5.17.1 |
Surface Resistivity | 2.5*107 | MΩ | COND A | IPC-TM-650 2.5.17.Q | |
Tensile Strength | 182 | Mpa(kpsi) | RT | ASTM D638 | |
26 | |||||
Bending Strength | 263 | Mpa(kpsi) | IPC-TM-650 2.4.4 | ||
37 | |||||
Dimensional Stability | <> | mm/m | IPC-TM-650 2.4.39A | ||
CTE | 17/17/28 | X/Y/Z | ppm/℃ | -55 -- 288℃ | IPC-TM-650 2.4.41 |
TD | 500 | ASTM D3850 | |||
Thermal Conductivty | 0.5 | - | W/m/K | 80℃ | ASTM C518 |
Water Absorptio | <0.10> | % | D24/23 | ASTM D570 | |
Density | 2.1 | gm/cm3 | 23℃ | ASTM D792 | |
Typical Peel Strength | >1.4 | N/mm | H oz | IPC-TM-650 2.4.8 | |
Flammability Rating | V-0 | UL 94 | |||
Lead-Free Process Compatible | Yes | ||||
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