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GT1650 high dielectric special ceramics powder PTFE High Frequency Copper-Clad-Laminate

Model
Nature of the Manufacturer
Other
Product Category
RF Copper-clad plate(CCL)
Place of Origin
City, Province
Overview
Main Features• High Dielectric Constant• Microwave Compoboard• Low Dielectric Loss• Hand type Reader Antenna• Excellent Machining Performance• Power Amplifiers、Filters And Couplers
Product Details

Product Overview

8-ChMPEG-2/H.264标清编码器

GT1650 laminate is a composite material of special enforcement by glass fibre and added high dielectric special ceramics powder PTFE, which is suitable for wireless communications equipment antenna and so on. This type laminate is made of high-molecular polymer, easy to process, and it has excellent mechanical performance and good effect on the miniaturization of antenna, also it provides the required miniaturization for miniaturized antennas especially for microwave power dividers, power combiners, electronic amplifiers, filters, couplers and other components.


Technical Specifications

8-ChMPEG-2/H.264标清编码器

Physical

standard thickness

standard size

standard copper foil

0.005〞(0.127mm)

48 X 36 (1220mm*914mm)

½ oz. (18μm) HTE (H/H)

0.010〞(0.254mm)

24 X 18 (610mm*457mm)

1 oz. (18μm) HTE (H/H)

0.025〞(0.635mm)

18 X 12 (457mm*305mm)

½ oz. (18μm) RTF (H/H)

0.050〞(1.270mm)


1 oz. (35μm) RTF (1/1)

Test Performance

Performance

Typical Value

Direction

Unit

Treatment Condition

Test

Method

GT1650

DK

6.5±0.05

Z

-

10 GHz/23℃

IPC-TM-650 2.5.5.5

DF

0.003

0.004

Z

-

10 GHz/23℃

IPC-TM-650 2.5.5.5

Temperature coefficient of Dk

-241

Z

ppm/℃

-50 到 150℃

IPC-TM-650 2.5.5.5

Volume Resistivity

2.0*105

XY

MΩ*cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

3.0*105


COND A

IPC-TM-650 2.5.17.Q

Tensile Strength

220


Mpa(kpsi)

RT

ASTM D638

32

Bending Strength

289


Mpa(kpsi)


IPC-TM-650 2.4.4

41

Dimensional Stability

<>


mm/m


IPC-TM-650 2.4.39A

CTE

18/18/28

X/Y/Z

ppm/℃

-55 到 288℃

IPC-TM-650 2.4.41

TD

500




ASTM D3850

Thermal Conductivty

0.8

-

W/m/K

80℃

ASTM C518

Water Absorptio

<0.10>


%

D24/23

ASTM D570

Density

2.6


gm/cm3

23℃

ASTM D792

Typical Peel Strength

>1.4


N/mm

H oz

IPC-TM-650 2.4.8

Flammability Rating

V-0




UL 94

Lead-Free Process Compatible

Yes






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