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Gospell Digital technology Co., LtdFree·1YRS
GT1350 PTFE High Frequency Copper-Clad-LaminateProduct Overview
NegotiableUpdate on September 29
- Model
- Nature of the Manufacturer
- Other
- Product Category
- RF Copper-clad plate(CCL)
- Place of Origin
- City, Province
Overview
Main Features• Good Thermostability• High Power RF and Microwave Amplifier• Low Dielectric Constant• Wireless Communication System• Excellent Machining Performance• Power Amplifier
Product Details
Product Overview
GT1350 high frequency circuit material is a product of special enforcement by glass fibre composed with PTFE, which can provide excellent electricity and mechanical stability. It is a kind of high dielectric constant circuit board material which can carry out a lot of information processing under UHF (GHz).It is an ideal material for RF and Microwave application areas. Dielectric constant is 3.5, dissipation factor is 0.0040, which can meet the performance of the design. Combined with glass fabric, the lamination surface is smooth that PTFE can use the standard PTFE printed circuit board to process the treatment technologies.
Technical Specifications
Physical | ||
standard thickness | standard size | standard copper foil |
0.005〞(0.127mm) | 48 X 36 (1220mm*914mm) | ½ oz. (18μm) HTE (H/H) |
0.010〞(0.254mm) | 24 X 18 (610mm*457mm) | 1 oz. (18μm) HTE (H/H) |
0.025〞(0.635mm) | 18 X 12 (457mm*305mm) | ½ oz. (18μm) RTF (H/H) |
0.050〞(1.270mm) | 1 oz. (35μm) RTF (1/1) | |
Test Performance | |||||
Performance | Typical Value | Direction | Unit | Treatment Condition | Test Method |
GT1350 | |||||
DK | 3.5±0.05 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
DF | 0.003 | ||||
0.004 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 | |
Temperature coefficient of Dk | -55 | Z | ppm/℃ | -50 -- 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.2*105 | XY | MΩ*cm | COND A | IPC-TM-650 2.5.17.1 |
Surface Resistivity | 2.0*105 | MΩ | COND A | IPC-TM-650 2.5.17.Q | |
Tensile Strength | 212 | Mpa(kpsi) | RT | ASTM D638 | |
30 | |||||
Bending Strength | 278 | Mpa(kpsi) | IPC-TM-650 2.4.4 | ||
39 | |||||
Dimensional Stability | <> | mm/m | IPC-TM-650 2.4.39A | ||
CTE | 18/19/24 | X/Y/Z | ppm/℃ | -55 -- 288℃ | IPC-TM-650 2.4.41 |
TD | 500 | ASTM D3850 | |||
Thermal Conductivty | 0.8 | - | W/m/K | 80℃ | ASTM C518 |
Water Absorptio | <0.10> | % | D24/23 | ASTM D570 | |
Density | 2.2 | gm/cm3 | 23℃ | ASTM D792 | |
Typical Peel Strength | >1.4 | N/mm | H oz | IPC-TM-650 2.4.8 | |
Flammability Rating | V-0 | UL 94 | |||
Lead-Free Process Compatible | Yes | ||||
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