Product Overview
GT1265 is reinforced with glass fiber cloth to improve mechanical property, because of its lower expansivity and stronger dielectric constant compared with the laminate of non-fiberglass, it is very suitable for the design of RF circuits. As a circuit material, mechanical properties, dielectric constant, dielectric loss relative to the temperature variation is very stable, and it is easy to be processed to the size and shape required for.
Technical Specifications
Physical |
standard thickness | standard size | standard copper foil |
0.005〞(0.127mm) | 48 X 36 (1220mm*914mm) | ½ oz. (18μm) HTE (H/H) |
0.010〞(0.254mm) | 24 X 18 (610mm*457mm) | 1 oz. (18μm) HTE (H/H) |
0.025〞(0.635mm) | 18 X 12 (457mm*305mm) | ½ oz. (18μm) RTF (H/H) |
0.050〞(1.270mm) |
| 1 oz. (35μm) RTF (1/1) |
Test Performance |
Performance | Typical Value | Direction | Unit | Treatment Condition | Test Method |
| GT1265 |
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DK | 2.65±0.05 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
DF | 0.002 |
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| 0.003 | Z | - | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
Temperature coefficient of Dk | -25 | Z | ppm/℃ | -50 -- 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 2.2*107 | XY | MΩ*cm | COND A | IPC-TM-650 2.5.17.1 |
Surface Resistivity | 3.3*107 |
| MΩ | COND A | IPC-TM-650 2.5.17.Q |
Tensile Strength | 182 |
| Mpa(kpsi) | RT | ASTM D638 |
| 26 |
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Bending Strength | 263 |
| Mpa(kpsi) |
| IPC-TM-650 2.4.4 |
| 37 |
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Dimensional Stability | <> |
| mm/m |
| IPC-TM-650 2.4.39A |
CTE | 17/17/25 | X/Y/Z | ppm/℃ | -55 -- 288℃ | IPC-TM-650 2.4.41 |
TD | 500 |
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| ASTM D3850 |
Thermal Conductivty | 0.5 | - | W/m/K | 80℃ | ASTM C518 |
Water Absorptio | <0.10>0.10> |
| % | D24/23 | ASTM D570 |
Density | 2.2 |
| gm/cm3 | 23℃ | ASTM D792 |
Typical Peel Strength | >1.4 |
| N/mm | H oz | IPC-TM-650 2.4.8 |
Flammability Rating UL 94 | V-0 |
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| UL 94 |
Lead-Free Process Compatible | Yes |
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