ShenZhen，GuangDong-
E-mail
tina@u-sheen.com
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Phone
86-769-22479425
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Address
Building M, Jinxiongda science and technology park, Datanglang, Dalingshan Town, Dongguan City, Guangdong Province, China
Product Categories
Sheen Electronical Technology Co.,Ltd.Free·1YRS
Thermal Liquid Gap Filler AB component
NegotiableUpdate on September 27
- Model
- Nature of the Manufacturer
- Manufacturer
- Product Category
- Thermal Liquid Gap Filler
- Place of Origin
- DongGuan City, GuangDong Province
Overview
Use Range: Thermal gel AB double component cooling gel is a soft silicone-based thermally conductive gap-filling material with high thermal conductivity, low interfacial thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. It is filled between the electronic components to be cooled and the heat sink/housing, etc., making them in close contact, reducing thermal resistance, and quickly and effectively reducing the temperature of the electronic components, thereby......
Product Details
Product Description
Thermal gel AB is a soft double component cooling gel,thermal conductive gap-filling material with high thermal conductivity, low interfacial thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. Thermal gel AB double component cooling gel is filled between the electronic components to be cooled and the heat sink/housing, etc., making them in close contact, reducing thermal resistance, and quickly and effectively reducing the temperature of the electronic components, thereby extending the life of the electronic components and improving their reliability. Thermal gel AB double component cooling gel can be applied by hａnd or by dispensing equipment.
Applications
◆ Hard disk, phone
◆ Optical precision equipment
◆ laptop
◆ and communication equipment
◆ Auto engine control equipment
◆ High-end industrial control and medical electronics
◆ Optical precision equipment
◆ laptop
◆ and communication equipment
◆ Auto engine control equipment
◆ High-end industrial control and medical electronics
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Product Parameters
| Thermal gel AB. | ||||||
| Grade ltem | SE250AB | SE300AB | SE400AB | |||
| Product performance | Test Results | Test Results | Test Results | |||
| Before mixing | Component A | Component B | Component A | Component B | Component A | Component B |
| Colour | Pink | Pink | Pink | Pink | Pink | Pink |
| Viscosity （mPa.s） | 800k | 800k | 400000 | 400000 | 700000 | 700000 |
| Density （g/cm3） | 2.8 | 2.8 | 3 | 3 | 3.1 | 3.1 |
| The mixing ratio | 1:1 | 1:1 | 1:1 | |||
| Shelf life @25℃（month） | 6 | 6 | 6 | 6 | 6 | 6 |
| Mixed performance | ||||||
| Colour | Pink | Pink | Pink | |||
| Volume resistance | >1013Ωcm | >1013Ωcm | >1013Ωcm | |||
| Thermal Conductivity | 2.5W/mK | 3.0W/mK | 4.0W/mK | |||
| Dielectric breakdown strength | >200VAC/milC/mil | >200VAC/milC/mil | >200VAC/milC/mil | |||
| Dielectric constant | 5.5 | 5.5 | 5.0 | |||
| Minimum interface thickness | 0.09mm | 0.09mm | 0.09mm | |||
| Operating temperature | -50~150℃ | -50~150℃ | -50~150℃ | |||
| Siloxane volatilization(D3~D12) | <300PPM | <300PPM | <300PPM | |||
| Thermal expansion coefficient | 175ppm/K | 175ppm/K | 175ppm/K | |||
| Flame retardancy | V-0 | V-0 | V-0 | |||
| Flame retardancy @25℃（Min） | 20 | 20 | 20 | |||
| Full cure time | ||||||
| 25℃（H） | 8 | 4 | 4 | |||
| 100℃（min） | 15 | 10 | 20 | |||
| Hardness after curing (Shore oo) | 40~90 | 40~90 | 50~90 | |||
| RoHS | PASS | PASS | PASS | |||
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