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Sheen Electronical Technology Co.,Ltd.
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    Building M, Jinxiongda science and technology park, Datanglang, Dalingshan Town, Dongguan City, Guangdong Province, China

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SMT Red Glue

Model
Nature of the Manufacturer
Manufacturer
Product Category
SMT Red Glue
Place of Origin
DongGuan City, GuangDong Province
Overview
Use Range: 3611B-09 Patch SMT red glue is a one-component,high-temperature, fast-curing epoxy adhesive. It is used for bonding SMD components on printed circuit boards.Safe to use and meet environmental requirements.
Product Details

Product Description

3611B-09 Patch SMT red glue is a one-component,high-temperature, fast-curing epoxy adhesive. It is used for bonding SMD components on printed circuit boards.Safe to use and meet environmental requirements.

 
I. Material characteristics before curing
ItemParameterTest method
ColourRedVisually
Yield value (25 ° C, Pa)620***
Specific gravity (25 ° C, g / cm3)1.36 ± 0.2***
Viscosity (25 ° C, cps)550,000 ± 10%***
Thixotropic index6.5 ~ 7.5***
Flash point (TCC)> 95 ℃***
Particle size<15um***
Copper mirror corrosionNo corrosionVisually

Use method & precautions

 

1. The 3611B-09 stored in the store needs to be warmed before use. Under the environment of 25 ° C, the normal temperature of 30ml is 2-4 hours, and the temperature of 200-300ml is 4-6 hours.
Precautions:
(1) To avoid contamination of unused glue, do not return any glue to the original packaging.
(2) Glue solution is barely placed in the air, it will absorb trace moisture and affect performance, so it should be avoided as much as possible. When printing on stencils, please do not leave the printed circuit board in the air for too long. It should be cured as soon as possible. If necessary, the humidity of the air should be controlled.
(3) If in a non-standard conventional environment: 25 ° C, please completely thaw according to the specific environment. Do not quickly thaw the glue by heating.

  

Curing condition test


 

The saved curing curve is shown below:

The suitable curing conditions are generally heating at 150 ° C for 90-120 seconds. The relationship between curing speed and final bonding strength and curing temperature and time is shown below.:

In the actual production process, the entire heating time is longer than the figure, because there is a preheating time.

Performance & characteristics


 

ItemParameterTest method
Density (25°C, g / cm3)
1.36±0.1
Visually
Coefficient of thermal expansion (um / m / ℃)a1 :  < Tg 50ASTM E831-86
Thermal conductivity W.M-1.K-1a2 :  > Tg 160ASTM C177
Specific heat KJ.Kg-1.K-1
0.25
***
Glass transition temperature (℃)
105-110
***
Dielectric constant
112
***
Dielectric tangent3.8100KHz***
Volume resistivity2.1*1015Ω.CMASTM D257
Surface resistivity2.1*1015Ω. CMASTM D257
Electrochemical corrosionAN-1.2DIN 53489
Shear strength (spraying low carbon steel sheet) N / mm26ASTMD1002
Pull-out strength N (C-1206, FR4 bare circuit board)63 
Torque strength N.mm (C-1206, FR4 bare circuit board)51 
 

Properties & Characteristics

 

Test method: ISO 4587 / ASTM D1002 shear strength
Test material: GBMS shear test piece
Curing method: curing at 150 ℃ for 30 minutes

 

Solid chemical resistance / solvent performance

 

Heat-resistant Solder Impregnation

 

According to IPC SM817 (2.4.421), the product 3611B-09 passed the hot solder dip test. Place the C-1206 capacitor bonded to FR4PCB with 3611B-09 on the solder pot at a temperature of 260 ℃ for 60 seconds, then immerse it in the pot for 10 seconds without any components falling off or shifting.
Storage & transportation】Store in a cool and dry place at a temperature of 2-8 ° C for 6 months.
【Package】 Customized packaging according to customer needs  
【Valid period】 This product is valid for 6 months
【Safety】 Please refer to our 《Material Safety Performance Data》(MSDS)

 
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