Disposable Skin Temp Sensor

product introduction

Disposable medical body surface temperature sensor is widely used to measure human body surface temperature. The sensor probe is made of epoxy resin, metal disc, and plastic case. The nominal resistance of the product is 2.252KΩ or 10KΩ. The total length of the product is generally 0.7 ~ 0.9 meters, and the measurement error is (25 ~ 45) ℃ ± 0.1 ℃.

Features

Disposable, can only be used once, clean and hygienic

High measurement accuracy (25~45)℃±0.1℃

Operating temperature range 0℃~50℃

Adapter cable can be used

Applications

It is used as a monitor, suitable for emergency, intensive care unit, operating room and other environments, and can continuously monitor the patient's body temperature.

Product structure and size (Unit:mm)

Product image:

The appearance, consistency, repeatability and stability of such products are recognized by domestic appliance manufacturers. Since the product was put on the market, because of its high cost performance, we have extensively cooperated with various home appliance manufacturers and actively researched and developed innovative products.

Transfer wire connection:

Package Quantity: 1 pcs/package

Precautions

--The use of this product: temperature measurement and control;

--Control the energy dissipation generated by the current flowing through the chip within the required range to avoid measurement errors caused by self-heating of components;

--If the heat-shrinkable sleeve is heated at the temperature-sensing head, the air outlet of the torch should be more than 30mm away from the temperature-sensing head to avoid resistance drift caused by excessive thermal shock to the resistor body due to high temperature.

--Storage temperature 0℃～50℃, humidity 30%~80%RH; avoid storing in corrosive gas or direct sunlight environment; need to reseal after opening the package.

--According to the structural characteristics of epoxy components, when users use it, they should avoid the component encapsulation head from being subjected to excessive stretching and bending force from the lead wire. If it is necessary to bend the lead wire, the bending point or force point should be controlled at the encapsulation head Leads other than 6mm below, so as not to strain the chip, resulting in resistance drift or even open circuit, especially when the component is heated