Aluminum Base PCB (PCB-03 Aluminium Gold Plating)

NegotiableUpdate on September 01

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Overview

Aluminum Base PCB (PCB-03 Aluminium Gold Plating)

Product Details

It's widely used for the modifier and sparker on fire for motorcycle and , power LED, sound box, power supply module and acoustics shielding system etc. The tapy and specification of Aluminum based PCB CCAF-01, CCAF-04-A, And 0.8mm, 1.0mm, 1.5mm, 2.0mm, etc. Thickness of the copper: 18um, 35um, 70um, 105um.

Item	Test item				Technology request	Unit	Test result
1	Peel Strength		A		≥ 1.0	N/mm	1.05
1	Peel Strength		After thermal stress (260 ordm;C )		≥ 1.0	N/mm	1.05
2	Blister test AfterThermal stress (288 ordm;C, 2min)				288ordm;C 2 min No delaminating	/	OK
3	Themal Resistance				≤ 2.0	ordm;C /W	0.65
4	Flammability(A)				FV-O	/	FV-O
5	Surface Resistivity	A			≥ 1 × 10 5	M Ω	5.0 × 10 7
5	Surface Resistivity	Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 5	M Ω	4.5 × 10 6
6 7	Volume Resistivity	A			≥ 1 × 10 6	M Ω· m	1.0 × 10 8
6 7	Volume Resistivity	Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 6	M Ω· m	1.9 × 10 7
8	Dielectric Breakdown (DC )				≥ 25	Kv/mm	31
9	Dielectric constant (1MHz) (40 ordm;C, 93% , 96h)				≤ 4.4	/	4.2
10	Dielectric dissipation factor (1MHz ) (40ordm;C ,93%,96h)				≤ 0.03	/	0.029
	Accelerated aging experiment (125 ordm;C ,2000h)				The laminate bace should no wrinkles,no crack,no delaminating or no pine	/	OK
11	High low temperature impact test (-50 ordm;C, 15min, 80ordm;C , 15minTOTAL DO 15 ~ 20 Circulation)			Peel Strength	/	N/mm	1.39 ~ 1.64
11				Surface Resistivity	/	M Ω	1.9 × 10 8 ~6.4 × 10 8

Item	Test item				Technology request	Unit	Test result
1	Peel Strength		A		≥ 1.0	N/mm	1.05
1	Peel Strength		After thermal stress (260 ordm;C )		≥ 1.0	N/mm	1.05
2	Blister test AfterThermal stress (288 ordm;C, 2min)				288ordm;C 2 min No delaminating	/	OK
3	Themal Resistance				≤ 2.0	ordm;C /W	0.65
4	Flammability(A)				FV-O	/	FV-O
5	Surface Resistivity	A			≥ 1 × 10 5	M Ω	5.0 × 10 7
5	Surface Resistivity	Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 5	M Ω	4.5 × 10 6
6 7	Volume Resistivity	A			≥ 1 × 10 6	M Ω· m	1.0 × 10 8
6 7	Volume Resistivity	Constant humidity treatment (90%,3 5 ordm;C ,96h)			≥ 1 × 10 6	M Ω· m	1.9 × 10 7
8	Dielectric Breakdown (DC )				≥ 25	Kv/mm	31
9	Dielectric constant (1MHz) (40 ordm;C, 93% , 96h)				≤ 4.4	/	4.2
10	Dielectric dissipation factor (1MHz ) (40ordm;C ,93%,96h)				≤ 0.03	/	0.029
	Accelerated aging experiment (125 ordm;C ,2000h)				The laminate bace should no wrinkles,no crack,no delaminating or no pine	/	OK
11	High low temperature impact test (-50 ordm;C, 15min, 80ordm;C , 15minTOTAL DO 15 ~ 20 Circulation)			Peel Strength	/	N/mm	1.39 ~ 1.64
11				Surface Resistivity	/	M Ω	1.9 × 10 8 ~6.4 × 10 8