Multilayer Flexible PCB Board
1.Introduction of Multilayer Flexible PCB Board
This is a type of polyimide PCB for the application of cable. It’s a single sided layer board at 0.1mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It’s fabricated per IPC 6012 Class 2 using supplied Gerber data.
Fastline Circuits is capable of providing full turnkey and partial turnkey printed circuit board assembly services. For full turnkey, we take care of the entire process, including preparation of Printed Circuit Boards, procurement of components, online order tracking, continuous monitoring of quality and final assembly. Whereas for partial turnkey, the customer can provide the PCBs and certain components, and the remaining parts will be handled by us.
Features-Our Products Advantage
1. Over 10 years experience manufacturer in PCB Assemble and PCB field.
2. Big scale of producing makes sure that your purchase cost is lower.
3. Advanced production line guarantees stable quality and long life span.
4. Produce almost any PCB as your requirement.
5. 99% test for all customized PCB products.
6. One-stop Service ,we can help to purchase the components.
Standard Flex Materials:
Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm)
Adhesiveless Copper Clad Base Material 1 mil to 5 mils
Flame Retardant Laminate, Base Material, and Coverlay
High Performance Epoxy Laminate and Prepreg
High Performance Polyimide Laminate and Prepreg
UL and RoHS Compliant Material on request
High Tg FR4 (170+ Tg), Polyimide (260+ Tg)
Base Copper:
1/3 oz. - .00047 in. (.012mm)–rarely used
1/2 oz. - .0007 in. (.018mm)
1 oz. - .0014 in. (.036mm)
2 oz. - .0028 in. (.071mm)
Solder Mask: Customized
Polyimide Coverlay: 0.5 mil to 5 mils Kapton (.012mm - .127mm)
with 0.5 to 2 mil Adhesive (.012mm - .051mm)
LPI and LDI Flexible Soldermasks
Flex PCB Capability
Fastline Circuits Co., Limited |
FPC Technology and Capabilities |
Material | FR4, Polyimide / Polyester |
Counts | Flex: 1~8L; Rigid-Flex: 2~8L |
Board Thickness | Min.0.05mm; Max. 0.3mm |
Copper Thickness | 1/3 oz — 2 oz |
CNC Drill Size (Max) | 6.5mm |
CNC Drill Size (Min) | Flex: 0.15mm |
Holes Location Tolerance | ±0.05mm |
Coverlay Drill Size (Min) | 0.6mm |
Hole to Coverlay Opening Windows (Min) | 0.15mm |
Min Line Width / Spacing | 0.1/0.1mm |
Copper Thickness on Hole Wall | Flex:12-22μm |
Min Pad Size | φ0.2mm |
Etch Tolerance | Finished line width tolerance ±20% |
Pattern Registration Tolerance | ±0.1mm (Working Panel Size: 250*300mm) |
Coverlay Registration Tolerance | ±0.15mm |
Solder Mask Registration Tolerance | ±0.2mm |
Solder Mask to PAD | Non photosensitive: 0.2mm |
| Photosensitive: 0.1mm |
Min. Solder Mask Dam | 0.1mm |
Misregistration Tolerance | ±0.30mm |
for Stiffener, Adhesive, Glue paper | |
Surface Finish | Plating Ni / Au ; Chemical Ni / Au ; OSP |