Fluxless Soldering by 20khz Ultrasonic Soldering Pot for Wire Tinning System

NegotiableUpdate on December 05

Model

Nature of the Manufacturer: Manufacturer

Product Category: Ultrasonic Assisted Equipment

Place of Origin: XiAn City, ShanXi Province

Online Consult Contact Information

Overview

Ultrasonic machining is the removal of material by the abrading action of grit-loaded liquid slurry circulating between the workpiece and a tool vibrating perpendicular to the workface at afrequency above the audible range.

Product Details

Fluxless Soldering by 20khz Ultrasonic Soldering Pot for Wire Tinning System

Introduction:

We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe's Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure refinement. The Permendur Power Probe offers the ability to acoustically activate molten metal in continuous or batch casting operations.

Ultrasonic soldering is used to join materials with either a metallurgical or mechanical bond.

A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this.

A mechanical bond usually involves no oxide on the base material. The cavitation and implosion in the solder create forces that agitate the materials and form an interlocking mechanical bond.

Coating a ceramic with solder is an example of this process.

When to use Ultrasonic Soldering

There are two main reasons for using Ultrasonic Soldering:

1. To eliminate the need for flux in the soldering process

2. To apply solder to ceramics and similar materials

The advantages of removing flux from the process are that there is no need for post-process

cleaning and wicking caused by surface tension from the flux is removed. Eliminating post-process

cleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit of

eliminating wicking is that the solder coating on the base material can be better controlled.

Parameter:

Model No.		RPS-DS20
Ultrasonic Frequency		20Khz
Maximum Output		1000 Watt
Temperature Range		150 ~ 400 °C
Power Supply		220V / 50-60 Hz
Ultrasonic Generator	Size	250(W) x 310(L) x 135(H) mm
	Weight	5 Kg
	Feature	Ultrasonic Amplitude Adjustable
Pot dimension		20*15cm
Avail Soldering Matrial		ITO Glass, AL, Mo, Cu etc.,

Characteristics

Easy soldering upon un-bondable material (metal, glass, ceramics) by simple dipping process.
No need for flux
Reliable bonding/sealing
Best used in difficult, small-surface places with limited access

Application coating on:

Aluminum components
Ferrite components
Glass components
Silicon wafers
Ceramic components
Semiconductor chips
Metals etc.