Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers) Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers) Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
Item
Capabilities
Number of Layers
Double Side
Material
FR-4,CEM-3,HighTg, Aluminum, Halogen Free
PCB Thickness
Min.thickness
0.2mm(8mil)
Max.thickness
3.2mm(128mil)
Surface finished
Gold Plating
Immersion Gold(Silver)
HAL Lead Free
Hot Air Solder Leveling(HASL)
Entek Coating (OSP)
Solder Mask
Green,White,Black,Yellow,Red,Blue
Other printing
Gold Finger
Carbon Print, Peelable Mask
Solder Mask Plugged Hole
Copper thickness
1/ 2 oz (18 μm) - 4 oz (140 μm)
Min. Finished Hole Size
0.3mm(12mil)
Hole Size Tolerance (PTH)
+/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH)
+/-0.05mm (2 mil)
Min. Line Width and Spacing
0.10mm (4 mil)
Min. Solder Mask Clearance
0.076mm (3 mil)
Min. Annular Ring
0.1mm (4mil)
Profile and V-Cut
CNC-Routing, Stamping and Beveling,V-CUT,CNC
Special Process
Micro-section, Chamfer for Gold Finger
Item
Capabilities
Number of Layers
Double Side
Material
FR-4,CEM-3,HighTg, Aluminum, Halogen Free
PCB Thickness
Min.thickness
0.2mm(8mil)
Max.thickness
3.2mm(128mil)
Surface finished
Gold Plating
Immersion Gold(Silver)
HAL Lead Free
Hot Air Solder Leveling(HASL)
Entek Coating (OSP)
Solder Mask
Green,White,Black,Yellow,Red,Blue
Other printing
Gold Finger
Carbon Print, Peelable Mask
Solder Mask Plugged Hole
Copper thickness
1/ 2 oz (18 μm) - 4 oz (140 μm)
Min. Finished Hole Size
0.3mm(12mil)
Hole Size Tolerance (PTH)
+/ -0.076mm (3 mil)
Hole Size Tolerance (NPTH)
+/-0.05mm (2 mil)
Min. Line Width and Spacing
0.10mm (4 mil)
Min. Solder Mask Clearance
0.076mm (3 mil)
Min. Annular Ring
0.1mm (4mil)
Profile and V-Cut
CNC-Routing, Stamping and Beveling,V-CUT,CNC
Special Process
Micro-section, Chamfer for Gold Finger
ZAPON GROUP is a well-known group specializing in the produce and sale PCB and PCBA. Has two PCB factories, one SMT factory and two Trade company. They are Zhejiang ZAPON Technology (speciqlizing in 1-16 layers FR4 PCB), Hangzhou Dejia Electronics (Specializing in 1-2 layers MCPCB & copper based PCB), Hangzhou H-power Electronics(SMT factory), China Electronics Zhejiang Company (before June 2018) and Hangzhou Chuanlian Electronics (responsible for Import & Export Business) respectively.
