Full-automatic wafer machine features reliable performance,compact structure,small occupation,high yield,lower energy consumption, durable usage, convenient maintenance,simple operation. The driven motors adopt SEW Germany, the bearings use SKF. Operating system uses PLC programing to make the process automated and easy control

Biscuit sample we can made

Capacity list

Features and Characteristics
► All motor, electrical equipments are international standard---famous international brａnd or Chinese brand

► Reasonable layout, compact structure, small occupation

► High automatic, stable performance,machine can be controlled separately, simple operation and easy maintenance

► Elements of wafer machine uses famous international or imported brand: motors from SEW Germany and bearings are high temperature prevent SKF Germany. HMI operation panel and PLC unit can be Mitsubishi or Siemens. Appliances adopts Danfoss, Schnerider, Omron. Conveyor belt is foodstuff PU quality.

3. List of complete line for reference

NO	Name	Dimension (L×W×H):mm	Power KW	QTY
1	SH-R75 plates Baking oven	14730×2000×2400	18.3	1
2	Sheet receiver	1723×1150×820	0.18	1
3	Cooling tower	2600×1050×2430	0.55	1
4	Sheet Picking machine	2200 ×1060×840	0.18	1
5	Cream spreading machine (one color)	2485×1200×1730	2.92	1
6	Vertical cooling cabinet	3700×1200×2612	18.83	1
7	Conveyor	2200×1050×980	0.18	1
8	Cutting and laminating machine	1545×2100×1100	0.75	1
9	Batter Mixer	1860×900×1600	5.5	1
10	Cream mixer	1700×800×1600	5.05	1
11	Smash machine	690×610×1250	3.0	1
12	Total		55.44	11

Wafer equipments in our customer’s workshop

Wafer sheet baking from oven, automatically transfer to cooling tower and cooling in the air. Cream will be automatically applied on wafer sheet, after the cooling from cooling cabinet, wafer book cut on cutting machine.

Baking oven has a great and effective burning inside oven chamber

Automatic batter deposit with accurate positioning

Cream applies on wafer sheet evenly by cream scraper

Wafer book cut in straight and smooth on Cutting machine by sanitation blade

Technical Parameters for each complete line:

Item	Description	Parameters
1	Output	2.5--7.5 tons/24 hours
2	Total power	55.44 kw (380V 50Hz)
3	Rate of finished product	More than 98％
4	Gas supply pressure	0.15-0.2 Mpa
5	Air compression value	0.9M3/Min/0.8Mpa
6	Baking plate size	470mm×325mm~500mm×350mm
7	Effective cutting size	455mm×315mm~485mm×340mm
8	Worker	4 person ( excluding packing workers)

Machines are packed in standard seaworthy package and shipped by container

China food machinery supplier, was established in 2003. It is one of China's large sacled companies specializing in automatical wafer production line. By using engineers and technicians' professional knowledge and rich experience, combined with various international brａnd machinery components, our company can manufacture automatic wafer production line with many advantages of reliable performance, high yield, low power, convenient maintenance, easy operation, no environmental pollution, etc, and receives good reputation from customers. 2